High Purity Tantalum Nitride TaN Powder CAS 12033-62-4, 99% |

About Tantalum Nitride TaN Powder :
Tantalum nitride is a kind of chemical material. Tantalum nitride formula is TaN and molecular weight is 194.95. Materials used to create precise sheet resistors which are resistant to water vapor. During the manufacture of integrated circuits, these films are deposited on top of the silicon wafer to form a thin film surface mount resistor. Tan tantalum nitride is a black hexagonal crystal. The relative density is 13.4, the melting point is 3090, the microhardness is 1100kg/mm2, the thermal conductivity is 9.54W/(m*K), and the resistivity is 128mO*cm.
Tantalum nitride is a yellow-green crystal of sodium chloride type with a relative density of 15.6.The lattice constants are A =0.4336nm and C =0.4150nm.The melting point was 2950, the microhardness was 3200kg/mm2, and the conversion point temperature was 17.8K.
Insoluble in water and acid, slightly soluble in aqua regia, soluble in potassium hydroxide and decomposed to release ammonia, heated to 2000 that is to release nitrogen.

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Product Performance of Tantalum Nitride TaN powder:
The molecular formula of tantalum nitride is TaN and the molecular weight is 194.95. Tantalum nitride is insoluble in water and acid, slightly soluble in aqua regia, soluble in potassium hydroxide and decomposed to release ammonia, and it releases nitrogen when heated to 2000degC.

Technical Parameter of Tantalum Nitride TaN powder:

Product Name	MF	Purity	Particle Size	Molecular weight	Density	Color
tantalum nitride	TaN	99%	5-10um	194.95	13.4 g/ml	black

Chemical Composition of Tantalum Nitride TaN powder:

TaN	N	Ta	Si	O	C	Fe
99%	4.8%	95.0%	0.01%	0.08%	0.02%	0.08%

How is Tantalum Nitride TaN Powder Produced?
1. Tantalum powder is directly nitriding with nitrogen or ammonia at about 1100;
2. Tantalum nitride is prepared by using tantalum and nitrogen as raw materials. The reaction formula is as follows: 2Ta+N2= 2TaN.

Applications of Tantalum Nitride TaN Powder :
Tantalum nitride is sometimes used in integrated circuit manufacturing to form a diffusion barrier or “glue” layer between copper or other conductive metals. In the case of BEOL treatment (about 20nm), copper is first covered with tantalum and then TaN is coated by physical vapor deposition (PVD). Before machining (grinding/polishing), the barrier-coated copper is coated with more copper through PVD and then filled with electrolytic-coated copper.
Tantalum nitride is also suitable for thin-film resistors, which have the advantage of forming a moisture-resistant passivation oxide film compared with nickel-chromium resistors
Materials used to create precise sheet resistors which are resistant to water vapor.
Tantalum nitride can be used as an additive for super hard materials to produce pure tantalum pentachloride, which can be used for spraying and increasing electrical stability of transformers, integrated circuits and diodes.
Packing & Shipping of Tantalum Nitride TaN powder :
We have many different kinds of packing which depend on the tantalum nitride TaN powder quantity.
Tantalum nitride TaN powder packing: vacuum packing, 100g, 500g or 1kg/bag, 25kg/barrel, or as your request.
Tantalum nitride TaN powder shipping: could be shipped out by sea, by air, by express as soon as possible once payment receipt.


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